[分享] 各品牌内存极品芯片一览

sunflow

A-Data威刚：
·PC2700(cl2.5) 可能是Winbond AH-6或BH-6
·PC3200 Winbond CH-5、Samsung TCCC
·PC3200特殊版Winbond BH-5
·PC3700(无散热片) Samsung TCC5
·PC4000(3-4-4-8) Hynix D43、D5，Samsung TCCC
·PC4000 Vitesta DDR500(3-4-4-8) ynix D43、D5，Samsung TCCD(少数)
·PC4500 Vitesta DDR566 Samsung TCCD—改良版JEDEC PCB或Hynix B(少数)
·PC4800 Vitesta DDR600 Samsung TCCD—改良版JEDEC PCB或Hynix B
Apacer宇瞻：
·PC2700 可能是Winbond AH-6
·PC4000 Samsung TCCD
Buffalo：
·PC3200部分为Micron 46V32M8 -5B C、46V32M8 - 5B G内存颗粒
·PC3700部分为Winbond BH-5、CH-5、Micron 46V32M8 -5B C内存颗粒
·FireStix PC4000 Hynix B
·FireStix PC3200 CL2(2-2-2-4) Samsung TCCD -采用Brainpower PCB(新品)
Centon：
·Advanced DDR Samsung TCCD
·New Advanced DDR533(3-4-4-8) Hynix D5
·New Advanced DDR400(2-2-2-5) Samsung TCCD—采用Brainpower PCB
Corsair海盗船：
·XMS-PC2700C2 Rev1.1(2-3-3-6-1T) 可能是Winbond BH-6/Samsung TCB3
·XMS-PC2700C2 Rev1.2(2-3-3-6-1T) Winbond CH-6
·XMS-PC2700C2 Rev1.3(2-3-3-6-1T) Mosel Vitelic(6ns？)
·XMS-PC2700C2 Rev2.1(2-3-3-6-1T) Micron(6ns rev B)/Samsung TCB3
·XMS-PC2700LL Rev1.1(2-2-2-6-1T) Winbond BH-6
·XMS-PC2700LL Rev1.2(2-2-2-6-1T) Winbond CH-6
·XMS-PC3000C2 Rev1.1(2-3-3-6-1T) Samsung TCB3/Micron(6ns rev B)、Winbond BH-6(少数)
·XMS-PC3000C2 Rev2.1(2-3-3-6-1T) 应该是Winbond BH-6
·XMS-PC3200C2 Rev1.0(2-3-3-6-1T) Winbond CH-5
·XMS-PC3200C2 Rev1.1/2.1(2-3-3-6-1T) Winbond BH-6
·XMS-PC3200C2 Rev1.2/2.2(2-3-3-6-1T) Winbond CH-6
·XMS-PC3200C2 Rev3.1(2-3-3-6-1T) Infineon B-5
·XMS-PC3200C2 Rev4.1(2-3-3-6-1T) Samsung TCCD
·XMS-PC3200C2 Rev4.2(2-3-3-6-1T) Samsung TCCD & TCC5
·XMS-PC3200C2 Rev5.1/6.1(2-3-3-6-1T) Mosel Vitelic 5ns(新品)
·XMS-PC3200LL Rev1.1/2.1(2-2-2-6-1T) Winbond BH-5
·XMS-PC3200LL Rev1.2/2.2(2-3-2-6-1T) Winbond CH-5
·XMS-PC3200LL Rev3.1(2-3-2-6-1T) Infineon B-5
·XMS-PC3200XL/XLPT Rev1.1(2-2-2-5-1T) Samsung TCCD
·XMS-PC3200XL/XLPT Rev1.2(2-2-2-5-1T) Samsung TCCD—采用Brainpower PCB
·XMS-PC3500C2 Rev1.1(2-3-3-7-1T) Winbond BH-5
·XMS-PC3700 Rev1.1(3-4-4-8-1T) Samsung TCCC
·XMS-PC4000 Rev1.1(3-4-4-8-1T) Hynix D43
·XMS-PC4000 Rev3.1(3-4-4-8) Samsung TCCC
·XMS-PC4400 Rev1.1(3-4-4-8-1T) Hynix D5
·XMS-PC4400C25(2.5-4-4-8-1T) Samsung TCCD—采用Brainpower PCB
Crucial：
·PC3200部分为Micron 46V32M8 -5B C、46V32M8 -5B G内存颗粒
·Ballistix PC3200(2-2-2-8) Micron 46V32M8 -5B G(内存编号可能被打磨)
·Ballistix PC4000(2.5-4-4-8) Micron 46V32M8 -5B G(内存编号可能被打磨)
GeIL金邦：
·Value PC3200 Blue(2.5-3-3-6) Infineon 5ns、Hynix D5、D43
·Golden Dragon PC3200(2-3-3-6-1T) WLCSP封装 w/Samsung芯片
·Ultra Platinum PC3200(2-3-3-6-1T) Winbond CH-5、Mosel Vitelic 5ns
·Ultra-X PC3200(2-2-2-5) Samsung TCCD (old ones)、Wibond BH-5、UTT(人工挑选、编号重新打磨)—采用Brainpower PCB(新品)
·Ultra-X PC4000PC4400(2-2-2-52，5-3-3-52，5-4-4-7 -1T) Samsung TCCD(人工挑选、编号重新打磨)—采用Brainpower PCB(新品)
·Golden Dragon PC3500(2.5-3-3-6-1T) WLCSP封装 w/Samsung芯片
·Ultra Platinum PC3500(2.5-3-3-6-1T) Winbond CH-5、Mosel Vitelic 5ns
·Golden Dragon PC3700(2.5-4-4-7-1T) WLCSP封装 w/Samsung芯片
·Golden Dragon PC4000(2.5-4-4-7-1T) WLCSP封装 w/Samsung芯片
·Ultra Series PC3200(2-3-3-6-1T) Samsung TCC5
·Ultra Platinum PC4000(3-4-4-8-1T) Hynix D43
·Ultra Platinum PC4200(3-4-4-8-1T) Hynix D43
·Ultra Platinum PC4400(3-4-4-8-1T) Hynix D5
G.Skill：
·G.SKILL PC3200(DDR400 1T)(2-2-2-5 1T)，(F1-3200BWU2-512MBGH/1GBGH) Winbond UTT—采用Brainpower PCB(新品)
·G.SKILL PC4800(DDR600 1T)(2.5-4-4-8 1T)，PC3200(2-2-2-5)，(F1-3200DSU2-512FF/1GBFF)Samsung TCCD(最新颗粒)—采用Brainpower PCB(新品)
·G.SKILL PC4400(DDR550)(2.5-4-4-8)，PC3200(2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) Samsung TCCD—采用Brainpower PCB
·G.SKILL PC4400(DDR550)(2.5-3-3-7)，PC3200(2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) Samsung TCCD(最新颗粒)—采用Brainpower PCB
·G.SKILL PC4800(DDR600)(2.5-4-4-8)，PC3200(2-2-2-5)(F1-3200DSU2-512LA/1GBLA) Samsung TCCD(最新颗粒)—采用Brainpower PCB
·G.SKILL PC4400(DDR550)(2.5-4-4-8)，PC3200(2-3-3-6)(F1-3200DSU2-512LD/1GBLD) Samsung TCCD—采用Brainpower PCB
Kingmax胜创：(不全)
·Hardcore PC4000 TSOP封装(3-4-4-8-1T) Hynix D5
Kingston金士顿：
·HyperX PC2700(2-2-2-5-1T)(KHX 2700)最初版为Samsung TCB3，之后改用Winbond BH-6、CH-6、CH-5，芯片经过打磨
·HyperX PC3000(2-2-2-6-1T)(KHX 3000)最初版为Samsung TCB3，之后改用Winbond BH-5，some BH-6，CH-5，CH-6 (芯片可能经过打磨)
·HyperX PC 3200(旧版，不是AK2、K2或者A)(KHX 3200) Winbond BH-5
·HyperX PC 3200K2(2-2-2-6-1T)(KHX 3200K2) Winbond BH-5
·HyperX PC 3200AK2(2-3-2-6-1T)(KHX 3200AK2) --chip--> Winbond CH-5
·HyperX PC 3200ULK2(2-2-2-5-1T)(KHX 3200ULK2) Samsung TCCD
·HyperX PC 3500(SPD参数2-3-3-7 @ 433Mhz，2-2-2-6 @ 400Mhz，旧版) (KHX 3500) Winbond BH-5 (芯片可能经过打磨)
·HyperX PC 3500K2(2-3-3-7)(KHX 3500K2) Winbond CH-5
·HyperX PC 4000K2(3-4-4-8)(KHX 4000K2) Samsung TCCC，Hynix D43，D5
·HyperX PC 4300K2(3-4-4-8)(KHX 4300K2) Hynix D5
·Kingston芯片被打磨为D328DW-45 03年18周以前的产品Winbond BH-5、CH-5(03年18周以后的产品两种芯片都有)
·Kingston芯片被打磨为D328DW-5 Winbond BH-5
·Kingston芯片被打磨为D328DW-6 Winbond BH-6
·Kingston芯片被打磨为D328DM-6 应该是Winbond BH-6
·Kingston芯片被打磨为D328DM-5 应该是Winbond BH-5
·Value Ram 333Mhz(2，5-3-3-*)(KVR333X64C25)部分产品为Winbond BH-6，AH-6，Hynix D43，D5(芯片可能经过打磨)
·Value Ram 400Mhz(2，5-3-3-*)(KVR400X64C25)部分产品为Winbond BH-5，CH-5，Micron 46V32M8 -5B C，Hynix D43，D5，Samsung TCCC，TCC4(芯片可能经过打磨)
Mushkin：
·PC2700(不属于Level X系列，rated 2-3-3，Promo-Build) Winbond CH-6
·PC3200 Cl2，5(不是Level X、Blue、Green) Winbond BH-5，Samsung TCB3
·PC3200(不是Level X，rated 2-2-2， Promo-Build) Winbond BH-5
·PC3200 Level I(2-3-2) Winbond CH-5
·PC3200 Level II(2-2-2) Winbond BH-5或者BH-6
·PC3200 Special 2-2-2 Winbond BH-6
·PC3200 Level II V2(2-2-2) Samsung TCCD
·PC3500 Level I(2-3-3) Winbond CH-5
·PC3500 Level II(2-2-2) Winbond BH-5
·PC3200 BLUE CL2 DC(2-3-3-X) Winbond UTT—采用Brainpower PCB(新品)
·PC3700(2，5-4-3) Samsung TCCD (rev. F)
·PC4400(2，5-4-4) Samsung TCCD (rev. F)—采用Brainpower PCB

OCZ：
·EL DDR PC3200 Gold Winbond新版BH5—采用Brainpower PCB(新品)
·EL DDR PC3200 Platinum Limited Edition(2-2-2-7) Winbond BH-6
·EL DDR PC3200 Platinum Edition(2-3-2-5) Samsung TCB3、ProMOS 5ns(打磨)， Mosel Vitelic 5ns(打磨)， Winbond CH-5
·EB DDR PC3200 Platinum Edition(2，5-3-2-8) Micron 46V32M8 -5B C
·EL DDR PC3200 Platinum Edition rev2(2-2-2-5) Samsung 4ns TCCD -采用Brainpower PCB
·EL DDR PC3200 DC Value VX(OCZ4001024WV3DC-K) (3-4-4-8 @2，6V) Windond UTT (被打磨为OCZ VX) -采用Brainpower PCB 808
·EL DDR PC3200 DC Gold VX(2-3-3-8 @2.6V | 2-2-2-8 @3.2V) --chip--> Windond UTT (relabeled as OCZ Voltage eXtreme) ~ Brainpower PCB 808
·EL DDR PC4000 DC Gold VX(2-2-2-8 @3.3V)--chip-->Windond UTT(relabeled as OCZ Voltage eXtreme)—Brainpower PCB 808(新品)
·EL DDR PC3500 Platinum Limited Edition(2-2-3-6) Winbond BH-5
·EL DDR PC3500 Platinum Edition(2-3-2-5) Winbond CH-5、少量BH-5
·EB DDR PC3500 Platinum Edition(2，5-3-2-8) Micron 46V32M8 -5B C
·EL DDR PC3700 Gold Edition rev1(2-3-3-7) Samsung TCB3(打磨)
·EL DDR PC3700 Gold Edition rev2(2，5-3-3-7) ProMOS 5ns(打磨)，Mosel Vitelic 5ns(打磨)
·EL DDR PC3700 Gold Edition rev3(2，5-3-3-8) Hynix DT-D5 -采用Brainpower PCB 808
·EB DDR PC3700 Platinum Edition (3-2-2-8/3-3-2-8) Micron 46V32M8 -5B C
·DDR PC4000(3-4-4-8) Hynix D5，D43 (打磨)
·DDR PC4200(3-4-4-8) Hynix D5，D43
·DDR PC4400(3-4-4-8) Hynix D5
·EL DDR PC4400 Gold Edition(2，5-4-4-8) Hynix B，Samsung TCCD (新品)
·EL PC4800 Platinum Edition(2，5-4-4-10 1T/2T @2，85V) Samsung TCCD(新版)—采用Brainpower PCB (新品)
OC-Wear：
·OC-WearDDR PC3200(2-3-3-6)—DDR560 CL 3-4-4-8 @ 2.8V Samsung TCCD -采用Brainpower PCB
Patriot：(不全)
·Patriot PDC5123200+XBLKPDC1G3200+XBLK(2-2-2-5) Samsung TCCD—采用Brainpower PCB
PQI：(不全)
·PQI Turbo Memory DC PC3200(2-2-2-5) Samsung TCCD—采用Brainpower PCB
·PQI Turbo Memory DC PC4000(2，5-3-3-7) Samsung TCCD—采用Brainpower PCB
Samsung三星：
·PC3200 Samsung TCC4，TCCC
·PC3700 Samsung TCC5
·PC4000 CL3 Samsung TCCD
Shikatronics：
·ShikaXram PC4400(3-4-4-8) Hynix B
SimpleTech：
Nitro PC4000(3-4-4-8) Hynix D5 (新品)

Team Group：
ASTAK DDR600 PC4800(3-4-4-8) Samsung TCCD—采用Brainpower PCB 808(新品)